Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate; Fast infrared and hot air heating, make temperature more accurate and evenness. Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly. It can achieve soldering of single and double-sides PCB board.

FEATURES

(1)  Large infrared soldering area: 300*320mm (T-962A)

(2) Eight soldering waves

(3) Special heat up and temperature equalization

Big power of energy efficient Infrared heating and air circulation to re-flow solder.

(4) Ergonomic design, practical and easily operated

(5) Large number of available functions

Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Warranty

Warranty – the main body maintains for one year and the spare parts maintains for three months.

Service – provide the immediate network online Q/A and the technical advisory work service

Delivery

Safe packing and fast delivery by air express.